Series LXP100 /LXP100 L TO-247
Derating
Derating (thermal resist.) LXP100 /LXP100 L: 0.66 W/K (1.5 K/W)
Without a heat sink, when in open air at 25°C,the LXP100 /LXP100 L is rated for 3 W. Derating for temperature above 25°C is 0.023 W/K.
Case temperature must be used for definition of the applied power limit. Case temperature measurement must be done with a thermocouple contacting the center of the component mounted on the designed heat sink. Thermal grease should be applied properly.
This value is only applicable when using thermal conduction to heat sink Rth-cs
Dimensions in millimeters
Specifications
Resistance ranges：0.05 Ω ≤ 1 MΩ (other values on special request)
Resistance Tolerance： ±1 0% to ± 1 %
Temperature Coefficient：≥ 10 Ω: ±50 ppm/°C referenced to 25 °C, ΔR taken at +105°C
(other TCR on special request for limited ohmic values)
Power rating:100 W at 25°C bottom case temperature derated to 0 W at 175°C
Maximum operating voltage：350 V , max. 500 V on special request
Dielectric strength voltage： 1,800 V AC
Insulation resistance:> 10 GΩ at 1,000 V DC
Dieletric strength: MIL-STD-202, method 301 (1,800 V AC, 60 sec.) ΔR < ±(0.15 % + 0.0005 Ω)
Load life:MIL-R-39009D 4.8.13, 2,000 hours at rated power, ΔR < ±(1.0 % + 0.0005 Ω) Moisture resistance:-10°C to +65°C, RH > 90 % cycle 240 h, ΔR < ±(0.50 % + 0.0005 Ω)
Thermal shock:MIL-STD-202, method 107, Cond. F, ΔR = (0.50 % + 0.0005Ω) max
Working temperature range:-55°C to +175°C
Terminal strength:MIL-STD-202, method 211, Cond. A (Pull Test) 2.4 N, ΔR = (0.5 % + 0.0005Ω)
Vibration, high frequency:MIL-STD-202, method 204, Cond. D, ΔR = (0.4 % + 0.0005Ω)
Lead material:tinned copper
Torque:0.7 Nm to 0.9 Nm M4 using a M3 screw and a compression wahser mounting technique
Heat resistance to cooling plate:Rth < 1.5 K/W
Weight:~4 g
Ordering Information
| Type | ohmic | ValueTOL |
| LXP100 | 100R | 5% |
